6G電信晶振 MMdcomp石英晶體 T12BC1-19.200MHZ-T,尺寸3.2x2.5mm,頻率19.2MHZ,美國(guó)麥迪康晶振,歐美進(jìn)口晶振,進(jìn)口無(wú)源晶體,貼片無(wú)源晶振,無(wú)源晶體,四腳貼片晶振,石英貼片晶振,輕薄型晶體,19.2MHZ石英晶振,無(wú)源石英晶體,石英晶體諧振器,環(huán)保型晶振,6G電信專用晶振,儀器設(shè)備晶振,蜂窩電話晶振,以太網(wǎng)石英晶振,小型設(shè)備晶振,平板電腦晶振,智能手機(jī)專用晶振,無(wú)線網(wǎng)絡(luò)晶振,藍(lán)牙音響晶振,高質(zhì)量晶振,低功耗晶振,低成本晶振,低損耗晶振,高精度晶振,具有超高的耐壓性能以及良好的穩(wěn)定性能,無(wú)源晶體產(chǎn)品超級(jí)適合用于小型設(shè)備,智能手機(jī),平板電腦,無(wú)線網(wǎng)絡(luò),以太網(wǎng),6G電信,藍(lán)牙音響等領(lǐng)域。6G電信晶振 MMdcomp石英晶體 T12BC1-19.200MHZ-T.
6G電信晶振 MMdcomp石英晶體 T12BC1-19.200MHZ-T 參數(shù)表
| Frequency Range | 19.200MHz | ||||
| Frequency Tolerance / Stability | (See Part Number Guide for Options) | ||||
| Operating Temperature Range | (See Part Number Guide for Options) | ||||
| Storage Temperature | -40°C to +85°C | ||||
| Aging | ±5ppm / first year Maximum | ||||
| Shunt Capacitance | 5pF Maximum | ||||
| Load Capacitance | (See Part Number Guide for Options) | ||||
| Equivalent Series Resistance (ESR) | See ESR Chart | ||||
| Drive Level | 10µW Typical / 100µW Maximum | ||||
| Insulation Resistance | 500 Mega ohms Minimum at 100Vdc |
6G電信晶振 MMdcomp石英晶體 T12BC1-19.200MHZ-T 尺寸圖
產(chǎn)品特征:
輕薄型SMD晶振
低老化
符合RoHS標(biāo)準(zhǔn)且無(wú)鉛
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