Bliley石英SMD晶振,6G無線晶振,BQCSC-50M3-DCBAT，尺寸5.00x3.20mm，頻率50MHZ，美國Bliley晶振，進口百利晶體，liley Crystal，輕薄型晶體，石英貼片晶振，石英晶體諧振器，石英貼片晶振，SMD晶振，無源石英晶體，小型設備晶振，儀器設備晶振，6G無線晶振，智能音響晶振，娛樂設備晶振，智能手機晶振，小型設備晶振，便攜式設備專用晶振，通訊產品專用晶振，網絡設備晶振，智能家居晶振，四腳貼片晶振，高性能石英晶振，高品質無源晶振，低功耗晶振，具有良好的耐壓性能以及穩定性能。
晶振外觀使用金屬材料封裝的,具有高穩定性,高可靠性的石英無源晶體,晶振外觀本身使用金屬封裝,充分的密封性能,可確保其高可靠性,采用編帶包裝,外包裝采用朔膠盤,可在自動貼片機上對應自動貼裝等優勢.Bliley石英SMD晶振,6G無線晶振,BQCSC-50M3-DCBAT.
Bliley石英SMD晶振,6G無線晶振,BQCSC-50M3-DCBAT 參數表
| Parameter | ConditionsFundamental3rdovertoneUnit | |||||||||||||||||||
| Frequency Range | 10.0 – 60.040.0 – 150.0MHz | |||||||||||||||||||
| Frequency Tolerance | @ + 25℃±50 Max (see options)ppm | |||||||||||||||||||
| Frequency Stability | ±100 Max (see options)ppm | |||||||||||||||||||
| Aging | Max 1stYear±3.0ppm | |||||||||||||||||||
|
Equivalent Series Resistance (max) |
8.0 – 12.0 MHz100Ω | |||||||||||||||||||
| 13.0 – 20.0 MHz80Ω | ||||||||||||||||||||
| 20.0 – 29.0 MHz50Ω | ||||||||||||||||||||
| 30.0 – 60.0 MHz40Ω | ||||||||||||||||||||
| 40.0 – 150.0 MHz80Ω | ||||||||||||||||||||
| Insulative Resistance | Min @ 100Vdc ±15Vdc500MΩ | |||||||||||||||||||
| Drive Level | 10 Typ, 200 MaxμW | |||||||||||||||||||
| C0 (Shunt Capacitance) | Max5.0pF | |||||||||||||||||||
| CL (Load Capacitance) | Per Option (typical)6-20 (see options)pF | |||||||||||||||||||
| DLD | 50nW to 100µW±10 Maxppm | |||||||||||||||||||
| RLD | 50nW to 100µW20% MaxΩ | |||||||||||||||||||
| Operating Temp Range | -20 to +70 / -40 to +85℃ | |||||||||||||||||||
| Storage Temp Range | -55 to +125℃ | |||||||||||||||||||
| Sealing Method | Seam Weld | |||||||||||||||||||
| Moisture Sensitivity Level | 1 | |||||||||||||||||||
Bliley石英SMD晶振,6G無線晶振,BQCSC-50M3-DCBAT 尺寸圖
貼片晶振產品特征:
SMD結構
標準5.0x3.2mm毫米包裝尺寸
整個溫度范圍內的高穩定性
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